Optimum process utilisation
When creating layer packages, individual layers of single-layer boards are glued in a cross pattern to achieve a high degree of dimensional stability. Glue is applied uniformly over the entire board surface using a glueing portal. Following every glue application, a vacuum portal crane lays the next (alternating transverse or longitudinal) layer precisely, edge to edge on the glued board. The board structure of a layer package should have at least 3 layers and can be a maximum of 600 mm thick. In the case of a thin layer structure, several board assemblies can also be laid on top of each other with a dry joint in each case and, simultaneously, pressed to achieve better process utilisation.